News


Combining technologies to speed availability of new FeRAM memory

24 January 2001 News

Infineon Technologies and Toshiba Corporation have announced a comprehensive agreement to develop nonvolatile memory technology and products based on the ferroelectric principle.

Ferroelectric Random Access Memory (FeRAM) represents a new paradigm in memory technologies. Using ferroelectric materials, FeRAM combines the high-speed and endurance of widely used dynamic and static random access memories with the ability to store information in the absence of power.

Technology and product work under the agreement will focus on memory cell structure development, boosting the number of read and write cycles, raising access speeds, enhancing long term reliability and establishing a method for resolving metal contamination of silicon during chip production, said the companies.

The advantages of FeRAM compared to NOR flash memory devices include SRAM-like fast read and program response times, low power consumption and an immense number of nonvolatile read and write cycles. This makes the technology well-suited for use in applications as diverse as game consoles, cellular phones, mobile products and IC cards. Infineon and Toshiba said they will introduce a 32M FeRAM as their first jointly developed product. It is expected to replace the current multi chip package (MCP) module for cellular phones, which consists of an SRAM chip and a NOR flash memory in a stacked configuration.

Toshiba can offer its advantages in PZT (lead zirconate titanate) process technology, its patented 'chained' cell structure, its 1T1C (1 transistor 1 capacitor) cell structure, and know-how gained in development of the 8M FeRAM. Infineon will contribute know-how in enhancing the number of read and write cycles and in resolving metal contamination of silicon.

Working from the state-of-the-art 8M FeRAM recently developed by Toshiba, the collaboration plans to produce and jointly market its first engineering samples in March 2001. Commercialisation of a 32M device is expected at the end of 2002, and the collaboration will then be extended to 64M, or as far as 128M devices, depending on market conditions.

www.infineon.com

www.toshiba.co.jp





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved