News


IBM, Infineon to advance revolutionary memory technology

24 January 2001 News

IBM and Infineon Technologies have announced plans to jointly develop a breakthrough memory technology that could significantly increase battery life of portable computing devices and lead to 'instant-on' computers.

The two companies have signed an agreement to collaborate in the development of magnetic random access memory (MRAM) which uses magnetic, rather than electronic, charges to store bits of data. MRAM may significantly improve electronic products - from computers to cellphones to game systems - by storing more information, accessing it faster and using less battery power than the electronic memory used today. MRAM also retains information when power is turned off, meaning products like personal computers could instantly start up, without waiting for software to 'boot up.'

IBM Research pioneered the development of a miniature component called the 'magnetic tunnel junction' as early as 1974, eventually adapting it as a means to store information and to build an actual working MRAM chip in 1998. Using this IBM technology, coupled with Infineon's considerable expertise in creating very high density semiconductor memory, the companies believe actual MRAM products could be commercially available as soon as 2004.

"MRAM has the potential to replace today's memory technologies in electronic products of the future," said Bijan Davari, IBM Fellow and Vice President of Technology and Emerging Products, IBM Microelectronics. "The announcement represents a major step forward for MRAM, quickly moving the technology out of the pure research stage into product development."

"Infineon and IBM are combining their technological capabilities and resources to help bring MRAM technology to maturity on a fast track," said Wilhelm Beinvogl, Senior Vice President of Technologies and Innovations, Memory Products, Infineon Technologies. "Our proven track record in the joint development of advanced memory and logic technologies is thus further extended by a very exciting and new kind of technology. For Infineon, MRAM technology offers equally interesting potential both for embedded logic products and standalone memory chip applications."

MRAM combines the best features of today's common semiconductor memory technologies - the high speed of static RAM (SRAM), the storage capacity and low-cost of DRAM and the nonvolatility of flash memory.

This nonvolatility carries significant implications, especially for emerging pervasive computing devices. Memory technologies like DRAM and SRAM require constant electrical power to retain stored data; when power is cut off, all data in memory is lost. A laptop computer, for example, works from a copy of its software stored in memory. When turned on, a working version of the software is copied from the hard disk drive into memory so the user can access it quickly. When power is turned off and then back on, the process has to start over. By using MRAM, the laptop could work more like other electronic devices such as a television or radio - turn the power on and the machine jumps to life.

Nonvolatility can save power as well. Since MRAM will not need constant power to keep the data intact, it could consume much less than current random access memory technologies, extending the battery life of cellphones, handheld devices, laptops and other battery powered products.

For more information on IBM Research, see www.research.ibm and for Infineon Technologies see www.infineon.com





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved