Automatic 3D inspection system combines AOI and AXI
4 April 2007Manufacturing / Production Technology, Hardware & Services
Viscom is claiming to set a new standard in combined optical and X-ray inspection with Viscom X7056, which offers true parallel inspection. Automatic optical inspection (AOI) has already been well established worldwide. Miniature components such as BGA, μBGA and CSP place additional demands on inspection systems to detect even hidden defects reliably and cost-effectively - and with robust inspection depth during rapid throughput. These are precisely the strengths of the X7056. This is a high-performance 3D automatic X-ray inspection (AXI) system with parallel top and bottom optical inspection, and it meets the high throughput rates required by today's electronics manufacturing, says Viscom.
The heart of the X7056's X-ray technology is the high-performance microfocus X-ray tube. It ensures a resolution of 15 μm per pixel. The company's new 3D X-ray iterative modelling also yields highly accurate image quality. Thus, complicated overlaps on PCBs populated on both sides can be resolved and easy-to-analyse features generated. With a 6-megapixel-sensor, the X7056 offers the highest inspection depth of all the Viscom systems. It can also be equipped with AOI cameras, for simultaneous inspection of both top and bottom sides of a PCB.
Simultaneous top and bottom inspection and double-track loading result in very rapid inspection and minimal handling times. The X7056 is fully modular, so it can be used as a combination AOI/AXI or pure AXI system. Additional features include rapid program generation with Viscom EasyPro software and the full scope of Viscom inspection algorithms. An optional high-performance VPC software module controls process monitoring and optimisation with a multitude of filter functions.
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