Erni Electronics’ new MicroSpeed connectors in a variety of different heights are ideal for high-speed data transfer in telecom and datacom applications.
The 1,0 mm modular shielded SMT connector system consists of two contact rows and two outwardly arranged shield plates. MicroSpeed connectors have been designed for space-saving board-to-board connections, and are equally suitable for differential and single-ended signals.
With the availability of different height versions of the male (1, 2, 9 and 10 mm) and female (4, 6, 8 and 10 mm) connectors, it is possible to create 16 different stacking heights from 5 mm to 20 mm. Subsequently, just about every demand for different PCB configurations is met for the electronics designer. Another major advantage is the multiple-connector mating capability - based on the high mating tolerance - that allows the mating of more than one connector pair at the same time, and offers high scalability of the contact number.
Areas of application include modern telecommunication and data transmission systems with speeds up to 10 Gbps, as well as technologies in the fields of measurement, medicine and government. In addition, the SMT version provides a fully automatic SMT assembly and reflow soldering process.
For impedance purposes, the longitudinal pitch of MicroSpeed connectors is 1,0 mm and the transverse pitch is 1,5 mm, and the differential signal pairs can be arranged horizontally or vertically. Optimised crosstalk behaviour is achieved with a vertical (transverse to longitudinal direction) configuration of the signal pairs, and the pairing arrangement of signal and shield contact pairs.
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