Passive Components


Must you have that capacitor?

14 February 2001 Passive Components

When demand for the most common types of capacitors is stretching the world's supply, the use of sensible alternatives can avoid difficulties and may even save money. Murata explains further.

By far the most popular capacitors used are the smaller multilayer ceramic chips (MLCCs). There are many variations available and they are increasingly replacing film and tantalum dielectrics. The majority are used in decoupling and bypass applications, although there is a significant use in temperature compensating and other functions.

Recently, the main changes in MLCCs have been in C/V per unit volume so that the designer can now select a given C/V in a smaller package, for example, many of the values traditionally ordered in 1206 and 0805 sizes are now in 0603 or even 0402. Volume users are moving to these sizes so there will be more of them when delivery schedules get tight.

Difficulties can be minimised at the design stage by using the smaller sizes and more flexible definitions of MLCCs for general applications, with particular reference to the dielectric and voltage ratings (VR) chosen. For example, why specify only one VR? Most circuits today run at something under 10 V. It would be reasonable to specify a 10 or 16 V MLCC, but why not specify 10, 16, 25 and 50 V where they are available in the size required?

MLCCs are often specified at unnecessarily high VRs. Unlike many other dielectrics, the VR of an MLCC is the maximum voltage at which it can be run continuously within the operating temperature range. There is no need for a safety margin to avoid punching a hole in the dielectric at RV +5%, because the breakdown voltage of an MLCC is well above the operating voltage.

The same principle applies to a lesser degree to tolerance. High K dielectrics do have temperature, voltage and frequency characteristics and the selection of these materials indicates an application that will tolerate them. This being the case, relaxing or tightening the tolerance to allow use of an alternative may well be acceptable.

In decoupling and bypass applications, the capacitance value is rarely critical. This suggests that similar but different dielectrics could safely be used. For example in a benign environment, why specify only an X7R dielectric (-55 to 125°C)? Why not consider Y5V and Z5U. They have a higher dissipation factor and change more with temperature, but why in signal lines where temperature is not changing very much and the value is not critical?

In applications calling for stability or temperature compensation, the situation is different but there are still opportunities to be more flexible.

The comments above about voltage rating still apply. For absolute stability COG (±030 ppm/°C) has to be the answer but perhaps COH (±060 ppm/°C) would suffice on some occasions?

With tolerance, in stable circuits there is a tendency to select the tightest available. This may be necessary, but in view of all the other variables, is it always the case?

Table 1 shows some of the dielectric alternatives you might consider at the design stage or when a specified part is not readily available. Clearly, changing between X7R, X5R, B and R dielectrics will have a negligible effect unless operating at the extremes of temperature and there is little to choose between Y5V and Z5U.

Table 1. Some dielectric alternatives
Table 1. Some dielectric alternatives

These are just examples of what might be done at the design stage or when there is a problem. Should you require assistance, contact the local Murata distributor.

Some of the alternatives for three popular devices are shown in Table 2. These are not the limits of the size/value ranges, they are just options for these values.

Table 2. Alternatives for three popular devices
Table 2. Alternatives for three popular devices



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Next-gen robotic systems initiative
EBV Electrolink Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.

Read more...
Compact high-current power inductor
EBV Electrolink Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.

Read more...
Tiny noise suppression filters
RS South Africa Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.

Read more...
Compact 1250 V choke solution
Electrocomp Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.

Read more...
Highly integrated 24-channel mixed signal IC
EBV Electrolink DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.

Read more...
Touch-enabled 32-bit MCU
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Die-cast enclosures in non-rectangular formats
Communica Enclosures, Racks, Cabinets & Panel Products
These models from Hammond Manufacturing, the 1590TRP and 1590STP, provide additional flexibility for product designers who require strong aluminium enclosures, but want alternatives to the traditional rectangular form factor.

Read more...
Tiny power inductor for low noise applications
iCorp Technologies Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.

Read more...
Advanced pressure monitoring sensor
EBV Electrolink Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.

Read more...
High-efficiency 600 V power MOSFET
EBV Electrolink Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved