Altera has announced FPGA-based support for Ethernet communications protocols used in industrial automation applications, including ProfiNet, Ethernet/IP, Modbus-IDA, EtherCAT, SERCOS III Interface, and Ethernet Powerlink. Intellectual property (IP) cores for these key communications protocols can now be implemented on Altera's low-cost Cyclone series FPGAs.
The Industrial Ethernet IP cores enable designers to implement any of the standards on a single board. This not only reduces form factor but saves time. System OEMs can now add industry-standard networking capabilities to their automation products cost-effectively, while retaining FPGA reprogrammable design flexibility in their systems.
To support Cyclone series FPGA-based industrial designs, IXXAT, one of Altera's IP partners, is offering an Industrial Ethernet development kit. The kit consists of a Cyclone-based reference design and evaluation board, schematics and executables for the FPGA bitstream, including a protocol stack, MAC, TCP/IP stack, interface application and a host application program interface (API) in source code.
Versatile range of camera modules EBV Electrolink
Opto-Electronics
The CAM-66GY pro-modules from ST are a full range of sample camera modules made for a seamless evaluation and integration of the VD66GY 1,5-megapixel colour image sensor.
Read more...Elevate your motor control designs EBV Electrolink
DSP, Micros & Memory
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions.
Read more...MCU for noisy environments EBV Electrolink
DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version