DSP, Micros & Memory


Communication controller passes FlexRay conformance test

3 October 2007 DSP, Micros & Memory

Infineon's standalone FlexRay communication controller CIC-310 has passed the FlexRay conformance test. Infineon boasts that it is among one of the first semiconductor suppliers to deliver high-volumes of FlexRay-enabled microcontroller solutions in conformance with the FlexRay protocol specification v2.1. The Conformance Test certificate was performed by TÜV Nord Group's Institute for Vehicle Technology and Mobility in Germany, an official conformance test organisation nominated by the FlexRay Consortium.

Infineon offers system suppliers a scalable solution to develop a FlexRay bus system in vehicles at an early design stage. The current Infineon FlexRay solutions consist of the CIC-310 and the TC1796 and TC1766 32-bit microcontrollers, part of the company's TriCore family, as well as the recently introduced XC2200 and XC2300 families which provide 32-bit performance. Furthermore, the CIC-310 can be used with most automotive microcontrollers or microprocessor architectures in the market, as the product offers a scalable and fast interface concept based on the Infineon Micro Link Interface (MLI) and on standard serial and parallel interfaces. Furthermore, for a faster implementation of FlexRay, AUTOSAR software drivers, which have been proven by the AUTOSAR Validator project, are available for the CIC-310.

"The volume production availability of our FlexRay communication controller, combined with the official certification, according to the latest FlexRay standard, will help enable our customers to develop state-of-the-art FlexRay solutions for automotive applications. Developing embedded FlexRay microcontrollers will underline Infineon's strength to offer full system solutions to its customers," said Carsten Loschinsky, director for application line Body, Chassis and Safety Microcontrollers at Infineon Technologies.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

High reliability memories
Altron Arrow DSP, Micros & Memory
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.

Read more...
KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Artificial intelligence meets embedded development
Avnet Silica DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.

Read more...
Embedded module for AI vision applications
Rugged Interconnect Technologies DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.

Read more...
High-speed Flash for SoC applications
NuVision Electronics DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.

Read more...
Super-fast H.264 encoder FPGA core
EBV Electrolink DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

Read more...
ST MCUs extend ultra-low power innovation
Altron Arrow DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.

Read more...
Chipset enables ultra-wide signal capture
RFiber Solutions DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

Read more...
SoC for real-time AI at the edge
Future Electronics DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

Read more...
HiRel components from Kyocera AVX
Electrocomp Passive Components
Kyocera AVX Corporation is a leading supplier of advanced components and interconnect solutions, offering a broad selection of passive components and connectors.

Read more...