Aries Electronics supplies a high pin count version of its PinBall Socket with over 1400 balls, featuring a customised heatsink designed for high-end graphics processors. This socket can be soldered directly to the existing footprint of a PC board to further increase packaging density. The aluminium heatsink provides effective thermal dissipation of excess heat generated by the high-performance graphics processors for which the socket is designed. The versatile BGA/LGA socket provides 2 mm of clearance for end components, and can be used for 0,80 mm, 1,00 mm, and 1,27 mm pitch packages up to 50 mm, in any footprint configuration and on any size board.
The socket incorporates Aries' high-reliability spring probe technology, with a spring force of 17 grams at 0,64 mm deflection. The spring is BeCu alloy, and the pins are gold-plated brass alloy, while the socket insulator is Torlon or PEEK with stainless steel hardware. The socket can be furnished with either a 2-bolt (for 15 mm packages and smaller) or 4-bolt (for 16 to 50 mm packages) hold-down.
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