Kemet has announced the expansion of its X7R Multilayer Ceramic Capacitor Flex Mitigation Portfolio with the introduction of the FF-CAP.
The FF-CAP incorporates two existing Kemet technologies: Floating Electrode (cascading electrode design) and Flexible Termination. The Floating Electrode component yields improved voltage and ESD performance over standard designs and also mitigates the risk of low-IR or short circuit failures associated with mechanical flex cracks. The Flexible Termination component incorporates a measure of flexibility to the capacitor, shifting flex stress away from the ceramic body and into the termination area.
FF-CAP's technology combination ensures an increased measure of protection from board flex, offering up to 5 mm of flex-bend capability. This provides an enhanced level of mechanical flex crack protection for low- to mid-capacitance part types and complements Kemet's current Open Mode, Floating Electrode and Flexible Termination technologies. In addition, the new product meets the requirements of the Automotive Electronics Council's AEC-Q200-Rev C and is being offered with 100% pure matte tin-plated terminations that allow for excellent solderability.
The FF-CAP is offered in case sizes ranging from EIA 0603 to EIA 1210, with rated voltages ranging from 6,3 V d.c. to 250 V d.c. Combined with the stability of an X7R dielectric, the FF-CAP offers customers a flex robust solution in low- to mid-capacitance values and an operating temperature range of -55°C to +125°C with zero bias capacitance shift limited to ±15% over that range. Capacitance tolerances offered include J (±5%), K (±10%) and M (±20%).
Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Tiny noise suppression filters RS South Africa
Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.
Read more...Compact 1250 V choke solution Electrocomp
Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.
Read more...Tiny power inductor for low noise applications iCorp Technologies
Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
Read more...High-endurance polymer tantalum capacitors
Passive Components
Panasonic Industry TDC Series POSCAP polymer tantalum capacitors deliver high endurance and reliable performance in demanding, high-temperature environments.
Read more...Thin-film inductors for optical transceivers RS South Africa
Passive Components
TDK has expanded its PLEC69B series (1,2 x 0,6 x 0,95 mm – L x W x H) of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centres.
Read more...Low-resistance MLCCs RS South Africa
Passive Components
TDK Corporation has expanded its CN series of low-resistance soft-termination multilayer ceramic capacitors; achieving 22 nF capacitance in the 3225 case size.
Read more...Precision in next-gen asset tracking Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX’s advanced antenna technologies have been engineered specifically for compact, high-performance tracking devices.
Read more...Miniaturised RFID Tags Electrocomp
Telecoms, Datacoms, Wireless, IoT
In the rapidly evolving landscape of Industry 4.0, where precision, resilience, and compact design are more than buzzwords, Neosid is revolutionising identification through its NeoTAG line of RFID transponders.
Read more...Ferrite cores with different shapes RS South Africa
Passive Components
TDK Corporation has introduced a variety of new large-size ferrite cores with different core shapes, making this the industry’s largest lineup of shapes, sizes, and materials for such large cores.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version