Altera's Stratix III FPGAs were presented with the International Engineering Consortium's (IEC) DesignVision Award in the Semiconductor and IC category. They were recognised by the IEC for their unique and innovative architecture, which enables Altera to deliver high performance and low power high-end FPGAs. The devices were also recognised for their DDR3 memory interface, which offers memory performance speeds in excess of 1067 Mbps.
Started in 2005, the IEC's DesignVision Award recognises technologies, applications, products and services judged to be the most unique and beneficial to the industry. DesignVision Award candidates are judged based on innovation, uniqueness, market impact, customer benefits and value to society.
"This year's winners exemplify the highest level of innovation in today's industry," commented IEC executive vice president Roger Plummer. "We are pleased to congratulate Altera for its Stratix III FPGAs, which received the 2008 DesignVision Award this week at DesignCon 2008."
A key architectural innovation of Altera Stratix III FPGAs is their power reduction capability, which includes Programmable Power Technology and Selectable Core Voltage. With these innovations, Altera is able to lower the devices' total power consumption by up to 50%, when compared to previous-generation high-end FPGAs.
"The architectural innovations in Stratix III FPGAs represent a significant development in enabling high-end FPGAs to serve as the heart of many systems, and winning a DesignVision Award validates the technology leadership position we have established in this area," said Danny Biran, senior vice president of product and corporate marketing, Altera Corporation. "These innovations bring unprecedented power savings to systems using high-performance programmable logic."
Read more...Anritsu and Bluetest to support OTA measurement
News
Anritsu Company and Sweden-based Bluetest AB have jointly developed an Over-The-Air measurement solution to evaluate the performance of 5G IoT devices compliant with the RedCap specification.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...New president for Avnet EMEA
News
Avnet has announced that Avnet Silica’s president, Gilles Beltran, will step into the role of president of Avnet EMEA.
Read more...DARPA sets new record for wireless power beaming
News
In tests performed in New Mexico, the Persistent Optical Wireless Energy Relay program team recorded over 800 W of power delivered for about 30 seconds with a laser beam crossing 8,6 kilometres.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.