Interconnection


Subminiature connectors in 0,8 mm pitch

14 May 2008 Interconnection

Erni Electronics has expanded its MicroStac SMT connector series to include a 0,8 mm grid with 9- and 14-pin versions.

With the introduction of the 9-pin design, board-to-board spacing of only 3 mm is now possible.

The MicroStac components are based on a patented hermaphroditic design. The connector and the counter-connecter are identical, whereby the otherwise typical subdivision of male and female multipoint connectors has been avoided. The combination of the subminiature construction and the special design means that these connectors are suitable for compact, but nevertheless demanding, applications. The range of applications is correspondingly broad - from sensor technology, medical instruments and mobile communication to automotive electronics, automation engineering, measurement technology, test equipment and building automation.

The special design and the SMT construction allow for economical and automatic assembly. The stability of the miniature components is supported by means of a tilt-proof contact principle with dual side positioning of the contact on the PCB. And, with the corresponding features of minimal weight (just 0,18 g for the 6-pin design), co-planarity of less than 0,1 mm and suction areas integrated in the insulating body for the vacuum pipettes of the pick-and-place robots, the assembly can be performed through high-speed automation.

In spite of the compact construction, the MicroStac products can achieve a high current-carrying capacity, and the contact principle enables the punching of thick panelling without bending. As a result, large cross-sections and radiating surface are possible, and both enable low self-heating. With an ambient temperature of 20°C and current feed to all contacts, the 1,6 A, 50-pin version can be processed safely and reliably.





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