14 May 2008Manufacturing / Production Technology, Hardware & Services
The water-based MPC (Micro Phase Cleaning) cleaner Vigon SC 200 from Zestron is designed to clean SMT stencils and can also be used for stencil underside wiping in printers.
For stencil cleaning, the product reliably removes solder pastes and SMT adhesives in a single process and is designed for use in spray-in-air and ultrasonic cleaning systems. It can also be used for the cleaning of misprinted solder paste. Depending on the type of fluxes, this applies equally well for both double-sided and single-side soldered circuit boards applications.
Vigon SC 200 can be used in closed-loop systems and provides very good filterability, and its high bath loading capability leads to long bath lifetimes, which result in low process costs. It leaves no residues on substrates and the inside of the equipment and does not require explosion-proof protection, as it does not have a flashpoint. Due to its mild formulation, the medium shows excellent material compatibility with stencils.
For underside wiping in SMT printers, the cleaner shows significant advantages compared to isopropylalcohol (IPA). It removes solder pastes not only faster and more effectively than IPA, but it furthermore wets the paper roll more efficiently. Thereby, the dosage quantity can be reduced by up to 50% and very good cleaning results are achieved even with a reduced number of cleaning cycles. This way the costs for cleaner paper roll can be minimised.
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