Vishay has announced a new toroidal, high-current, high-temperature inductor that offers high rated and saturation current, and low inductance and DCR.
With a high operating temperature rating to +200°C and a toroidal design to reduce EMI, the new TJ3-HT inductor is optimised for switching power supplies, EMI/RFI filtering, and output chokes in automotive, and deep well drilling products.
The low-cost device offers designers horizontal and vertical mount options to optimise the PCB layout. With 10 standard inductance values to choose from, the inductor features a maximum DCR range from 0,108 Ω down to 0,0016 Ω when vertically mounted, and 0,118 Ω to 0,002 Ω when horizontally mounted.
The TJ3-HT offers a wide inductance range from 100 ìH down to 0,39 μH, with a high rated current from 2,25 A up to 32 A, and saturation current from 1,15 A up to 23 A. The inductor provides low magnetic radiation and is RoHS compliant. Custom values and current ratings are available upon request.
Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...Cutting-edge hybrid capacitors Avnet Silica
Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Power inductors iCorp Technologies
Passive Components
he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.
Read more...SMT power inductors Future Electronics
Passive Components
The Würth Elektronik WE-MXGI SMT power inductors are the latest addition to Würth Elektronik’s moulded power inductor series, engineered for high-frequency power applications.
Read more...Large capacitance MLCCs at 100 V RS South Africa
Passive Components
TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors to 10 µF at 100 V in 3225 size.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.