Liquid gap filling material
23 July 2008
Manufacturing / Production Technology, Hardware & Services
Bergquist has released its latest liquid gap filling solution, Liquid Gap Filler 1500. This product is a silicone based, two-component, room or elevated temperature cured product. As dispensed, this material is ultra-conforming and is ideal for filling unique and intricate air voids and gaps.
As cured, Gap Filler 1500 is a soft, thermally conductive, form-in-place elastomer that is dry to the touch and will not pump out from the interface. It dispenses where desired without 'stringing' and offers thermal conductivity of 1,8 W/m-K. It features superior slump resistance and high shear thinning characteristics for optimised consistency and control during dispensing.
The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. Gap Filler 1500 exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.
As cured, Gap Filler 1500 is ideal for fragile assemblies. Typical applications for this product include automotive electronics, telecommunications, computer and peripherals, between any heat generating semiconductor and a heatsink, or as a thermally conductive vibration dampening.
For more information visit www.bergquistcompany.com
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