Multichip modules incorporate SuperH micro and synchronous DRAM

28 March 2001 DSP, Micros & Memory

Hitachi offers eight new models in its HJ94/93D/93 Series of multichip modules (MCMs). Each of the MCM models incorporates a high performance SuperH microprocessor and synchronous DRAM (SDRAM) in a single package, enabling the speedy development of smaller and more powerful systems. They are ideal for use in a wide range of applications, such as industrial and consumer products with an emphasis on portable devices.

This MCM series is capable of aiding the development of ultra small systems. This is due to the single package offering of high performance SuperH together with high speed SDRAM. The HJ945010BP model features an SH-4 and four 64 Mb SDRAMs in a BGA package size of just 31 x 31 mm. This means that the mounting area can be cut to approximately 1/6 that of previous implementations. In addition, the high speed bus offers a data transfer speed of 100 MHz between the SH-4 and memory, eliminating the need for high speed bus design.

Additional memory can be connected externally as required by the system configuration, allowing the system memory capacity to be increased while still maintaining a compact system size.

* The HJ94 Series incorporates a SH7750 microprocessor with an SH-4 CPU core that provides 200 MHz or 360 MIPS performance. This series is suitable for embedded applications such as Internet TV, image processing systems, graphics oriented applications and other operations that require a high performance CPU featuring excellent floating-point performance.

* The HJ930 Series has a 133 MHz SH7729 microprocessor with an SH3-0SP CPU core. The high speed audio, voice and image data compression/decompression capabilities of its OSP make it suitable for use in consumer multimedia devices with a built-in browser or network products, such as routers, with a built-in VoIP.

The HJ93 Series, incorporating a 133 MHz SH7709A microprocessor with an SH-3 CPU core, offers low power consumption that makes it ideal for portable information terminals such as handheld PCs.

[email protected]

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...

---

AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...

---

Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...

---

Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...

---

Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...

---

Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...

---

Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...

---

Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...

---

Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...

---

Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

Read more...

---