Providing designers with a high density FPGA, Altera has announced the availability of new 8 x 8 mm packaging (M164) for its family of 65 nm Cyclone III FPGAs. Designers of space-constrained high-volume applications in consumer, military and industrial markets can now take advantage of the low power and high density of these devices.
The new 164-pin package with up to 16 K logic elements (LEs) extends Cyclone III's high-density small-package offering that includes 14 x 14 mm 256-pin (U256) and 17 x 17 mm 484-pin (U484) packages. Cyclone III devices deliver 5 K to 120 K LEs, up to 4 Mbits of memory and up to 288 digital signal processing (DSP) multipliers.
Highly integrated 24-channel mixed signal IC EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
Read more...Touch-enabled 32-bit MCU EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Smarter compact automation with LOGO! 9 RS South Africa
Programmable Logic
Siemens recently announced LOGO! 9, the latest generation of its compact logic controller designed for small automation projects in both industrial and building applications.
Read more...Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
Read more...High-performance FPGA family EBV Electrolink
DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Automotive Ethernet communications EBV Electrolink
News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
Read more...Versatile range of camera modules EBV Electrolink
Opto-Electronics
The CAM-66GY pro-modules from ST are a full range of sample camera modules made for a seamless evaluation and integration of the VD66GY 1,5-megapixel colour image sensor.
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