Infineon has put together two new sample kits devoted to TVS diodes for high-speed applications (KIT TVS DIODE 1) and to RF/Antenna applications (KIT TVS DIODE 2).
KIT TVS DIODE 1 contains samples from the ESD8V0R1B-, ESD5V3U1U and ESD3V3U1U- series. Due to their low capacitance and inductance values, these diodes provide efficient ESD/transient protection of high-speed interfaces such as HDMI 1.3, 10/100/1000 Ethernet, FireWire and USB 2.0. All samples are available in both TSSLP-2-1 and TSLP-2-1 versions, for applications where space is at a premium.
KIT TVS DIODE 2 proposes effective solutions to overcome the ESD/transient problem in RF/antenna and high-speed applications. This includes applications in anti-parallel configuration for low RF-signal levels without superimposed DC voltage, such as: GPS\, DVB (digital video broadcasting), DAB (digital audio broadcasting), and Remote Keyless Entry, as well as applications in rail-to-rail configuration including DC biased lines where the RF signal levels do not approach the clamping reference voltages, such as LNB interfaces, HDMI, S-ATA, and Gbit Ethernet.
In addition to the samples, the kits feature a CD with a complete set of data sheets, as well as application notes and examples for all discrete products.
New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Robust series of vertical-mating battery connectors Electrocomp
Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...Cutting-edge hybrid capacitors Avnet Silica
Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
Read more...Compact high-performance antennas Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol 2,4 GHz antennas ideal for use in SiP applications.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version