Axicom's IM relay is the first telecom/signal relay worldwide to be approved within the CECC/IECQ System of assessed quality electronic components following the new International Standard IEC 61811-55 for 4th-generation relays.
With a size of only 10 x 6 x 5,65 mm, the IM relay is actually the smallest available relay on the market, claims Axicom. The innovative design allows a slimline and low profile relay in only one design, combining minimum boardspace and minimum height.
Three different versions of IM relays are available: one through-hole type and two surface-mount types - an L-Leg and a Gull Wing version. The relays are capable of withstanding soldering conditions with a maximum temperature of up to 245°C and are hence suitable for all current soldering techniques. The small size and low weight allows the assembly of relays on the board with all standard high-speed pick-and-place machines, resulting in additional cost improvement.
Typical applications for the IM relays are wherever high reliability and extreme robustness are required and at the same time where high system integration is required. Many applications have already been realised for this relay, such as high density subscriber linecards, broadband Internet access with ADSL technology, modems, etc.
Axicom expects demand for these relays to increase dramatically with the market volume estimated at more than 300 million pieces per year in 2003.
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