1 October 2008Manufacturing / Production Technology, Hardware & Services
To further increase users’ comfort and product performance, Zestron has fully redesigned its Vigon RC 101 spray bottle head. Vigon RC 101 is a water-based cleaning agent specifically recommended to remove all types of burned-in flux residues from reflow and wave solder equipment.
The new spray head allows for the regulation of spray pressure, which results in the reduction of necessary pumping. Furthermore, the wide angle nozzle feature permits a more economical and even quicker cleaning of large surfaces. A point to point spraying feature can also be selected for the effective removal of burned-in flux residues. This improved spray performance leads to a reduction of overall down-time.
Vigon RC 101 has no flash point and can be applied directly onto cold or warm oven surfaces. Successfully tested with eutectic as well as lead-free flux residues, it is recommended by leading manufacturers of reflow and wave solder ovens.
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