Aries Electronics has released its new CSP/MicroBGA test and burn-in socket that accommodates devices of up to 6,5 mm squared and is suitable for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.
The socket offers solderless pressure mount compression spring probes, which can be accurately located by two moulded plastic alignment pins and mounted with two stainless steel screws, which allow the sockets to be easily mounted to and removed from the burn-in-board (BIB). This operator friendly socket highlights an overall small profile, allowing a maximum number of sockets per BIB and BIBs per oven.
The socket also features a pressure pad compression spring that provides proper force against the device and allows for height variations in device thickness. In addition, the gold over nickel-plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls.
The socket accommodates up to 500 000 cycles and operates at a temperature of -55°C to 150°C. The sockets are comprised of spring probes with contact forces of 15 g per contact on 0,30 mm to 0,35 mm pitches, 16 g per contact on 0,40 mm to 0,45 mm pitches, 25 g per contact on 0,50 mm to 0,75 mm pitches and 25 g per contact on an 0,80 mm pitch or larger.
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