9 GHz socket system for BGA/µBGA packages
11 April 2001
Interconnection
Emulation Technology (ET), a leader in sockets, adapters and test accessories for digital design and test, has introduced a new solderless ball grid array (BGA) socket system that operates at up to 9 GHz bandwidth. This socket system allows the user to socket any BGA or MicroBGA using one of five sockets which can accommodate every lead pitch, ball count, grid size and package size combination. Applications include development debug, hand test, programming, test of ASIC or FPGAs, package and chip qualification and production prototype to high volume socketing.
The ET Silver Wings 9 GHz solderless socket system mounts directly to the PCB using four predefined tooling holes. It mounts quickly with no soldering required, avoiding PCB and/or device damage. This system gives design engineers a reliable method for changing package sizes in seconds by changing only the adjuster plate and contactor pad.
This system is designed to accept BGA packages with lead pitches of 0,50, 0,75, 0,80, 1,00 and 1,27 mm. The use of elastomer conductors instead of conventional metal contact pins allows for a package pitch change without the conventional requirements for a newly tooled.
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