Aries Electronics is now offering its high-frequency Centre Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6,5 mm squared with pitches down to 0,3 mm. The reduced socket pitch meets the growing need to test smaller components while increasing reliability.
The cost-effective sockets feature replaceable interposer sets and require minimal handler tooling for use in an increased number of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices. With an operating temperature from -55°C up to 150°C, the new sockets are suitable for devices that require exceptional thermal management qualities in a compact package.
The sockets’ solderless pressure mount compression spring probes, accurately located by two moulded plastic alignment pins and mounted with two stainless steel screws, enable easy mounting to and removal from the printed circuit board for RF sockets and the burn-in-board (BIB) for test and burn-in sockets.
The heat-treated beryllium copper compression spring probes are plated in a minimum of 0,75 micron gold per MIL-G-45204 over a minimum of 0,75 micron mm nickel per SAE-AMS-QQ-N-290, so that the probes leave very small witness marks on the solder balls’ bottom surface. The probe can be either sharp-pointed (for non-BGA devices) or crown shaped (for BGA). The four-point crown version ensures scrub on the solder balls and a pressure pad compression spring provides the proper force against the device to allow for height variations in device thickness.
Signal path of the sockets is only 1,96 mm. Sockets with a 0,30 mm to 0,35 mm pitch feature only 15 G of contact force per contact and a test PCB diameter of 0,23 mm. Each socket is rated for a minimum of 500 000 cycles. Moulded components come standard in UL94V-0 Ultem but are also available in custom materials, platings, sizes and configurations to suit specific customer applications.
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