BCcomponents now offers an SMD capacitor specified above 150°C.
Specified at 175°C, the Hi-TMP175 exceeds the previous industry-best temperature rating by 50°C, giving it exceptionally long lifetimes as well as high ripple current capabilities. Its performance makes it a practical substitute for many applications currently requiring tantalum and 'Os-con' products.
According to Jaap Beijersbergen, Product Manager at BCcomponents, the new product is well timed, "There is a clear need for passive components with substantially higher temperature ratings than have been available to date. Take the next generation of mobile phone network infrastructures for example. The network hardware must remain super-reliable over several generations of handsets. The next-generation of phones makes this even more important. BCcomponents is working with our industry partners to create the building blocks that will help the industry take its next giant leaps."
The Hi-TMP175 combines the small footprint characteristics of SMD with the reliability of solid aluminium technology. The capacitor will be available up to 68 µF, offer increased ripple current capabilities and decreased ESR values, suited to low voltage power applications. The solid aluminium technology has increased shock resistance and also leads to greater product lifetimes. Added reliability is boosted by the large reverse voltage capability. Even greater increases in product lifetimes and reliability are anticipated from the Hi-TMP200, says BCc.
The high temperature features of Hi-TMP175 are ideally suited to many automotive, power supply and telecom applications. Its solid aluminium features ensure high performance in heated circuit board environments, making it ideal for computer and telecom developers. In addition, its ESR and ripple current handling make it ideal for buffering, smoothing and filtering.
Cooling solutions for modern electronics Future Electronics
Passive Components
As electronic systems become more compact and powerful, effective thermal management has become a critical aspect of product design.
Read more...DC-link capacitors with ultra-low inductance Electrocomp
Passive Components
TDK Corporation recently released its new series of MKP DC high-frequency film capacitors, a high-performance DC link capacitor platform for next-generation SiC-based power electronics.
Read more...Generating negative voltages from a positive supply Altron Arrow
Editor's Choice Passive Components
It is common for IoT devices, industrial sensors, meters, and medical equipment to require both a positive and negative voltage, and this article explains the options available to produce a negative rail from a positive rail supply.
Read more...Non-contact linear position sensor Electrocomp
Test & Measurement
The Vishay 40 LHE Linear Position Sensor, designed for industrial motion control and automation, delivers robust, non-contact measurement performance using Hall effect technology.
Read more...High-precision thick-film resistors Avnet Silica
Passive Components
The new Panasonic ERJPC high precision thick-film resistors series deliver accuracy levels previously only achievable with thin film technology, offering customers higher power density and cost-effective performance.
Read more...Semi-shielded power inductors RS South Africa
Passive Components
The SDCx family from Eaton includes the SDCL and SDCH series of semi-shielded power inductors designed for reliable performance in consumer, industrial, energy, and medical applications.
Read more...Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Tiny noise suppression filters RS South Africa
Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.
Read more...Compact 1250 V choke solution Electrocomp
Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.
Read more...Tiny power inductor for low noise applications iCorp Technologies
Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version