Power LED thermal substrates

18 February 2009 Manufacturing / Production Technology, Hardware & Services

To shorten time to market for LED-based illuminations in lighting industry form factors, Bergquist has introduced ready-to-use Thermal-Clad insulated metal substrates (IMS) in standard star, square, array and strip formats.

10 different contact patterns are available, supporting high-power LEDs from Osram, Lite-On, Lumex, Lumileds, Cree, Seoul Semiconductor, Nichia and Avago Technologies. Currently available configurations are single-device star or 36-up star arrays as well as square boards in a 17-up strip.

Thermal-Clad IMS enhances thermal management for high-power LED lighting designs, enabling higher driving currents for increased brightness as well as ensuring lower junction temperature for greater reliability and longer operating lifetime. Using Thermal-Clad IMS also enables designers to achieve the desired light output with fewer individual LEDs, to deliver smaller, more competitive lighting solutions.

These substrates have more than three times the thermal conductivity of conventional FR4 PCB, achieving 1,3 W/m-K to enable efficient thermal coupling to a heatsink or ambient. The substrates comprise a 1,57 mm gauge aluminium base plate, thermally conductive dielectric and 35 micron copper circuit foil. They are delivered ready to use, with white solder mask and HASL solder pads.

For more information visit www.bergquistcompany.com

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