Silicone-free thermal interface material

18 February 2009 Manufacturing / Production Technology, Hardware & Services

MH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices.

U 90 material consists of a ceramic-filled polyurethane film with thermal conductivity of 6,0 W/m-K and thermal impedance of just 0,05 Kin²/W. The material has a high voltage breakdown property of 4,0 kV and provides strong perforation protection with a tensile strength of 2,5 N/mm² and a Shore A hardness of 70.

Typical applications for silicone-free U 90 thermal interface pads include medical devices, laser equipment, lighting systems, solar energy, disc drives and aerospace electronics.

Keratherm U 90 is available in 0,100 and 0,200 mm thicknesses. Standard and custom shapes are available in continuous rolls for automated or manual application.

For more information visit www.mhw-intl.com

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