With the new C32 series, Epcos offers very compact, accurate and flexible pressure sensors in chip technology. Measuring just 1,6 x 1,6 mm, they are designed for pressure ranges from 1 to 40 bar, making them suitable for applications in automotive, industrial and medical electronics where miniaturisation plays a critical role.
The typical nonlinearity of the C32 sensors is only 0,3% FS. The chip also has high cyclic stability with drifts of only 0,1% FS under temperature stress. It is equipped with optimised bond pads which have spatially offset test-pad structures for wafer probers. Like the existing C28 and C29 series, the new miniaturised C32 variant allows glass pre-packaging at chip level on both the top and bottom of the chip.
The glass package on the underside allows low-stress processing of the chips with bond and adhesive techniques for absolute and differential pressure applications. The reference volume for absolute pressure measurements is formed by an additional glass substrate on the top side of the chip. These measurements are consequently also possible in non-aggressive liquids and gases.
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