3G SD evaluation kit

29 April 2009 Design Automation

In an effort to help engineers in the broadcast video industry to get a leg up on the critical front-end for 3 Gbps serial digital interface (3G SDI), Samtec in collaboration with Brioconcept and Gennum, has developed a customised Final Inch evaluation kit for 75 Ω 3G protocol.

The evaluation kit is accurate at measuring 3G SDI signal quality in the connector breakout regions. It simulates the entire transmission line paths from BNCs through high-speed interconnects (the Samtec HSEC8 series Edge Rate connector) and the equalisers and cable drivers on the active board. This ensures that the breakout region and the PCB will not significantly contribute to signal degradation.

The evaluation kit utilises high quality Samtec SMA connectors to launch signals to/from the system for performance measurement. The True 75 BNC is also integrated into the passive interface cards with all three typical orientations represented ie, edge launch, vertical mount and right angle.

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