Aries Electronics has added a new adapter series to its line of Correct-a-Chip adapters, in the from of the BGA Switch-A-Pitch adapters which enable the use of smaller pitch devices with larger pitch boards.
The first Switch-A-Pitch adapters in the series have tops where the BGA 'landing pads' (on the top of the adapter) are on a 0,5 mm pitch, while the adapter bottoms are populated with BGA balls at 1,27 mm pitch.
These adapters can reduce high density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints. In essence, the adapters allow the use of new, tighter pitch devices on existing larger pitch designs, which lowers the PCB cost since larger pitch boards are readily available and therefore more economical.
Since the top of the adapter board can leave open space around the small device, adapter manufacturers can add components to the design at a low cost. The need for laser-drilled microvias on motherboards is eliminated. Standard line and trace spacing down to 0,75 mm can be used.
Switch-A-Pitch boards are 1,57 mm thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined pads are finished with electroless nickel immersion gold and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. The device can operate up to 105°C for FR4 or up to 130°C for lead-free. Suggested PCB pad sizes include 0,55 mm for a 1,27 mm pitch.
Switch-A-Pitch adapters are available in panelised form, as an adapter only or as a turnkey solution with mounted devices. Specialising in custom design and production, Aries offers standard products as well as special materials, platings, sizes and configurations upon request.
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