Design Automation


Development kit supports Cyclone III FPGAs

13 May 2009 Design Automation

New from Altera is the Embedded Systems Development Kit, Cyclone III FPGA Edition, a comprehensive platform that accelerates the prototyping and development of FPGA-based embedded systems.

This multiboard development kit features a Cyclone III EP3C120 high-density, low-cost FPGA and combines a robust set of onboard memories, I/O interfaces, peripherals and pre-built reference designs. With the recent release of Wind River Linux support for Altera’s Nios II soft processor, designers can use this hardware platform as a basis for developing embedded Linux designs.

The kit contains a selection of pre-built processor systems, intellectual property (IP), operating systems and software applications. Users create their FPGA-based embedded system by selecting from a multitude of onboard example processor systems, demonstration designs and reference designs. The kit includes Altera’s complete design suite DVD featuring the Quartus II Web Edition design software, ModelSim-Altera Starter Edition, the Nios II embedded design suite and Altera’s MegaCore IP library.

The development kit is a three-board solution that includes a Cyclone III FPGA development board, featuring two high-speed mezzanine connectors (HSMCs), an LCD multimedia HSMC board and a multipurpose HSMC card. The Cyclone III FPGA development board features an EP3C120F780 FPGA, 256 MBytes of dual-channel DDR2 SDRAM with ECC, 8 MBytes of pseudo SRAM, 64 MBytes of Flash and a 10/100/1000 Ethernet communication port.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

General-purpose MCU with RISC-V architecture
EBV Electrolink DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

Read more...
AI-native IoT platform launched
EBV Electrolink AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.

Read more...
Serial SRAM up to 4 MB
EBV Electrolink DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.

Read more...
Microchip expands its mSiC solutions
EBV Electrolink Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.

Read more...
Powering up the intelligent edge
EBV Electrolink DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Read more...
New Studio 6 SDK
Design Automation
New Simplicity Studio 6 SDK opens development environment, and opens developers to Series 3.

Read more...
Flash for AI
EBV Electrolink AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.

Read more...
UFS Ver. 4.0 embedded Flash memory devices
EBV Electrolink Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.

Read more...
InnoSwitch5 Offline Flyback Switcher IC
EBV Electrolink Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.

Read more...
IGBT power module
EBV Electrolink Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.

Read more...