Aries Electronics has developed a new patented CSP/BallNest hybrid socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0,30 mm pitch or larger.
The ZIF-style (zero insertion force) socket uses solderless, gold-plated pressure mount spring probes, allowing for easy mounting and removal from the printed circuit board (PCB). The design maintains constant force throughout the entire test and burn-in cycle as well as on the surface mount PCB when no chip is engaged.
The socket bolts down onto the target PCB in the same footprint as the socketed device. This process also enables the socket to be mounted to an adapter board terminated with male through-hole pins, effectively creating a through-hole solder tail socket for BGA devices. The socket cover can also incorporate heatsinks for added test and burn-in flexibility.
A four-point crown ensures ‘scrub’ on solder oxides. The gold-over-nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls, further increasing reliability. With a signal path of only 1,96 mm, the socket provides minimal signal loss for high bandwidth capability. Special lid designs and materials are available upon request.
The socket’s contact forces are 15 G per contact on a 0,30 mm to 0,35 mm pitch, 16 G per contact on a 0,40 mm to 0,45 mm pitch, 25 G per contact on a 0,50 mm to 0,75 mm pitch and 25 G per contact on a 0,80 mm pitch or larger. Operating temperature is -55°C to 150°C and estimated contact life is 500 000 cycles.
As with all Aries sockets, the new test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
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