Phase change thermal interface material

13 May 2009 Manufacturing / Production Technology, Hardware & Services

Bergquist has introduced the latest in thermally conductive phase change materials, Hi-Flow 565U and Hi-Flow 565UT.

Both materials perform like high-end thermal greases, yet can be applied in pad form, eliminating the mess and application headaches normally associated with conventional grease. Hi-Flow 565U is dry to the touch and provided in tabulation form for easy placement, while 565UT is naturally tacky and is also supplied in tabulation form.

Both materials have a phase change temperature of 52°C and offer thermal impedance of 0,04°C-in2/W (565U) at 25 psi and 0,05°C-in2/W for the 565UT.

Hi-Flows 565U and 565UT are un-reinforced materials and are ideal for high performance applications, compensating for varied surface finishes and flatness tolerances. Typical applications include central processing units, graphics processing units, Northbridge (memory controller hubs), bare dies and chipsets.

The materials are available in bulk roll form and as tabulated parts on a roll. Thicknesses of 0,127 mm and 0,254 mm are standard offerings. Custom thicknesses, sizes, and die-cut shapes are also available.

For more information visit www.bergquistcompany.com

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