Erni’s MicroSpeed blind mate connectors are designed for signals running up to 10 Gbps and are offered in an assortment of board-to-board stack heights from 5 mm to 20 mm in 1 mm increments.
For rugged applications, the connector housing comes with thick side walls and is manufactured from high impact resistant thermoplastic UL94 V-0 rated LCP. The housing provides two polarised guide elements for alignment and secure mating.
The modular and shielded SMT signal connectors are available with two rows and 50 pins and offer an operating temperature range of -55°C to +125°C. While the signal contacts are made with SMT termination, the engineer can select between two termination options for the enveloping shielding depending on the application: SMT or through hole reflow (THR) for extra heavy cards or extra maximum mechanical stain relief. In addition, SMT signal coplanarity is 100% guaranteed, less than 0,10 mm on all contacts. With a minimum of 500 mating cycles, the signal and power connectors are engineered even for applications with severe vibration.
The signal connector’s longitudinal pitch of 1 mm and transverse pitch of 1,5 mm allow the differential or single-ended signals to be arranged horizontally or vertically to meet specific impedance requirements. Enhanced crosstalk behaviour is achieved through a variety of layout configurations and is supported with test data.
The MicroSpeed places no restrictions on the number of mated connectors used between two boards. By providing generous misalignment tolerances on the longitudinal axes of ±0,8 mm and transverse axes of ±0,7 mm, MicroSpeed can be strategically placed on the PCB to keep copper traces as short as possible while reducing unnecessary and costly board layers.
MicroSpeed connectors are supplied in tape and reel packaging. They have black insulator housings for visual recognition and a pre-mounted pick-and-place cover for easy assembly onto the PCB.
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