Silicon Laboratories recently announced the introduction of its C8051F7xx family of high pin-count MCUs for cost-sensitive, high I/O embedded systems. This family offers a new, patent-pending touch sensing feature that is said to be robust, accurate, responsive and easy to configure.
Offering up to 54 general purpose I/O pins and a 25 MIPS 8051 CPU, the C8051F7xx family brings a high level of processing power and flexibility to applications such as industrial controls, security systems, residential HVAC, home appliances, keyboards, cash machines and fax/printer/scanner front panels.
The touch sense on-chip peripheral uses a capacitance-to-digital converter (CDC) with a 40 μs acquisition time which, when combined with the 25 MIPS CPU, enables sophisticated human interface functions, even when large arrays of touch sense elements are used. To combat issues in electrically noisy environments, the CDC offers high noise immunity. With up to 32 touch sensing inputs, featuring wake-on-touch, the MCU can be placed in a power saving mode and wake quickly upon touch to save overall system power in applications. An intuitive software GUI allows fast and easy configuration and an API library is provided for all common touch sense configurations such as virtual buttons, wheels and sliders.
The C8051F7xx family also provides a number of onboard analog features. A 10-bit successive approximation (SAR) analog-to-digital converter (ADC) with on-chip voltage reference and temperature sensor provides capability for measurement and control. Up to 54 general purpose I/Os are offered to be used as ADC voltage measurement inputs, capacitive touch-sense inputs and/or digital communications I/Os. A calibrated two percent oscillator with guaranteed accuracy over the full MCU voltage supply and temperature range eliminates the need for an external crystal. In addition, the C8051F7xx family offers byte-erasable EEPROM with 100 000 write/erase cycle endurance guaranteed for storage of frequently updated data.
Also available is a development kit including IDE, target board, cables and power supply. A Silicon Labs GUI is provided for setup of the capacitive touch sense peripheral to get the desired configuration and performance. A separate capacitive touch sense evaluation kit provides fast and easy evaluation of the Silicon Labs capacitive sensing solution.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.