Cree has developed the industry’s first multichip MC-E LED with red, green, blue and white chips – all in a single package. It is also pairing new LED chip innovations with its industry-leading XLamp XP-E package to deliver a high performance family of discrete, high-power colour LEDs.
The XLamp MC-E is a compact component that provides design flexibility for colour-changing LED applications that require high flux from a small lighting source, such as entertainment and architectural lighting. It provides up to 22% more flux than the existing XLamp XR colour portfolio, with an 80% smaller footprint. The XP colour portfolio is available in flux bins, at 350 mA, up to 39,8 lumens for blue, 107 lumens for green and 56,8 lumens for both amber and red.
Compared to the current XLamp XR colour LEDs, space between the LED die can be reduced by 75% with the new XLamp XP-E colour LEDs and 94% with the new XLamp MC-E colour LED. This reduction in spacing can allow better colour mixing and shadow reduction for colour-based applications, including decorative, architectural and entertainment lighting.
Microchip expands maXTouch M1 touchscreen controller Altron Arrow
DSP, Micros & Memory
Microchip Technology has again expanded its maXTouch M1 family of touchscreen controllers, now covering free-form widescreen format displays up to 42 inches down to small compact screens in the 2 to 5 inch range.
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Test & Measurement
Specifically designed for long-range, multitarget measurements, the VL53L4CX from ST Microelectronics provides very accurate distance measurements up to 6 m with excellent results over short distances.
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DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.
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Opto-Electronics
X-ray has developed a high-performance range of HV generators designed for accuracy, long-term durability, and seamless integration into OEM environments.
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Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
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Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
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Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
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Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
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Telecoms, Datacoms, Wireless, IoT
Vishay Intertechnology has introduced a new series of infrared (IR) receiver modules for IR remote control applications, which feature a wide modulation frequency acceptance from 30 kHz to 68 kHz.
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Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
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