Telecoms, Datacoms, Wireless, IoT


Selecting the right wireless component supplier

8 July 2009 Telecoms, Datacoms, Wireless, IoT

Although the use of radio waves to render useful consumer services began as far back as before the Second World War with two-way radios, devices that featured a wireless service as core functionality débuted in what could be considered their first mass adoption when NTT introduced the first cellular telecoms service in Japan in 1979.

In today’s world, it is a market enforced de facto trend to enable electronic products with wireless interfaces complementing the core functionality of these products, albeit that in many instances this wireless feature is the main functionality. Technologies such as Bluetooth, GPS, WiFi and 3G are just some of the mature transmission media that are built into a typical modern electronic product.

As more devices incorporate RF, local electronic ODMs, OEMs and electronic equipment integrators who offer products that feature wireless as a core or auxiliary functionality have to thoroughly examine how capable potential component distribution partners are to fully nurse the needs of a successful product throughout its entire lifecycle. Irrespective of how insignificant to an end product a coaxial cable, connector, module, internal or external antenna, transceiver or controller IC might be regarded as, designers should rigorously solicit the following vital information from their component suppliers.

* Is your supplier ISO certified for in-house manufactured goods? Are their suppliers ISO approved? Is your supplier voluntarily open for inspection to verify whether these standard approvals are internalised within the organisation as opposed to being a ‘tick in a compliance box’?

* Are the components type-approved for local regulatory bodies’ needs? Has your supplier previously worked with local network operators for approval of your product in their networks?

* Does your supplier offer you fully specified documentation, or are they giving you a load of ‘specmanship’ as opposed to real useful data? Using an antenna as a case study, are parameters such as polarisation, VSWR, PIM, XPD, XPI and gain specified in unambiguous standard terms? For RF subsystems that are going to be integrated into a larger system, are reference designs freely available?

* Does the supplier have in-house skills to handle the field application support when inevitable discrepancies arise between specifications that a component was promised to meet, versus what is being practically achieved? Is the supplier’s applications integration support able to aid you in the right direction based on previous experience? Needless to say, if your supplier always points to data sheets as a means of answering your questions, without any effort to offer proven past reference applications, you waste a lot of your own time discovering pitfalls.

* Does the supplier have any in-house testing equipment (VNAs, oscilloscopes, field spectrum analysers, GSM/GPS development boards) to demonstrate typical behaviour and to do batch screening of components or acceptance test procedures verified from overseas acquired components?

* Is your supplier able to handle short lead times for moderate quantities and ex-stock samples for advertised products?

These are some of the questions that your component distributor should answer ‘yes’ with no hesitation. It is these objectives and services that Otto Marketing strives to offer its customers by way of its sales engineers focusing on customers’ products.

For more information contact Barry Culligan, Otto Marketing, +27 (0)11 791 1033, contact@otto.co.za, www.otto.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wireless connectivity expanded
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.

Read more...
Integrated X-band radar front-end module
RF Design Telecoms, Datacoms, Wireless, IoT
Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.

Read more...
Introducing Aurata
CST Electronics Telecoms, Datacoms, Wireless, IoT
Antenova has launched Aurata SR4L112: a compact, high efficiency embedded 4G/LTE antenna engineered for long, narrow PCB designs.

Read more...
Multi-constellation GNSS module in a legacy-compatible footprint
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.

Read more...
Quectel expands 5G portfolio
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.

Read more...
Compact RTK design: More than just the receiver
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.

Read more...
Microchip advances Space-Grade timing performance
ASIC Design Services Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.

Read more...
Channel emulator for 6 G and Wi-Fi 7/8
Concilium Technologies Telecoms, Datacoms, Wireless, IoT
With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.

Read more...
Secure, low-power Bluetooth LE SoC
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.

Read more...
High-isolation RF switch optimised for broadband cable
Telecoms, Datacoms, Wireless, IoT
pSemi Corporation has announced the PE42727 UltraCMOS SPDT RF Switch, a high-isolation solution optimised for next generation broadband cable applications.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved