Epcos has presented an improved and particularly rugged version of SMT power inductors. Their design, which features a base-plate with injection-moulded termination clips, increases the mechanical stability and improves the temperature distribution during the solder process. Lands with a nickel barrier-layer coating satisfy the tougher demands for use in applications such as automotive electronics.
The new series currently comprises six types: four shielded (P series) and two unshielded (M series). Depending on the type, their dimensions range between 7,3 x 7,3 x 4,5 mm and 12,5 x 12,5 x 8,5 mm. The components are available with inductances from 0,82 to 1000 μH, and have a current handling capability of up to 15 A. Their series resistance is only 5,5 m at low inductances. All types are designed for operating temperatures of up to 150°C and pass a vibration test of 10 G for 72 hours. They also satisfy the requirements of the handling-drop test to ISO 16750-3, as well as being qualified to the AEC-Q200 standard and satisfying the solder profile to JEDEC-020-C.
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