Vishay recently released two new multiplexers that are optimised for ±15 V high-precision, low-noise signal switching in data acquisition, industry process control, test and measurement, and medical systems. The design of the 8-channel DG508B and dual 4-channel DG509B makes the devices ideally suited for high-precision multiplexing in the analog front end of A-to-D networks, where fast and accurate data acquisition performance is required.
The CMOS analog multiplexers provide an extended maximum voltage rating to 44 V, with rail-to-rail analog capability, and can be operated in either a dual or single supply configuration. The devices are fabricated on an enhanced SG-II CMOS process with channel off-leakage typically less than 3 pA in a wide analog signal range. The source-off parasitic capacitance is minimised to 3 pF, and charge injection is less than 2 pC.
The devices have low power consumption, typically 10 μA at 25°C with a guaranteed maximum of 600 μA over temperature. The enhanced SG-II CMOS process also allows them to achieve a -3 dB bandwidth greater than 200 MHz with crosstalk and off-isolation of -40 dB at 100 MHz, making them a versatile fit for a wide range of analog signal applications, including video.
The on-channel of the DG508B and DG509B conducts current equally well in both directions, while each channel blocks voltages up to the power supply rails in the off state. The multiplexers feature an enable function to reset all switches to off for stacking of several devices. Features also include TTL-compatible logic and break-before-make switching action to protect against momentary crosstalk between adjacent channels.
The DG508B and DG509B are both available in 16-pin SOIC and TSSOP packages with an extended temperature range of -40°C to +125°C. The devices feature lead-free terminations and are RoHS-compliant and halogen-free according to IEC 61249-2-21.
High-performance IMU RS South Africa
Analogue, Mixed Signal, LSI
TDK Corporation has announced availability of the new InvenSense SmartMotion ICM-536xx family of high-performance 6-axis IMUs.
Read more...MCU for noisy environments EBV Electrolink
DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.
Read more...High-temperature closed-loop MEMS accelerometer RS South Africa
Analogue, Mixed Signal, LSI
This sensor from TDK is a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling applications.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Dual accelerometers on the same die Altron Arrow
Analogue, Mixed Signal, LSI
The LSM6DSV320X is the first mainstream inertial sensor to house a gyroscope alongside two accelerometers, one capable of sensing up to ±16 g and one sensing up to a staggering ±320 g.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Mibbo QT2C Series signal isolators Conical Technologies
Analogue, Mixed Signal, LSI
The Mibbo QT2C Series isolators support a rich combination of input and output signals, working with either current loops or voltage levels.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.