Interconnection


Samtec expands high-speed offering

19 August 2009 Interconnection

Samtec has expanded its high-speed interconnect and cable line featuring its rugged Edge Rate contact system to include a new 0,8 mm pitch board level system (QEM8/QEF8 series) that is footprint compatible with Samtec’s 0,8 mm pitch QSE/QTE series Q Strip high-speed interconnects.

Edge Rate right angle and edge mount terminals and sockets offer up to 150 I/Os in single-ended or differential pair configurations with a standard choice of 10 to 75 positions per row (depending on orientation). Designed for rugged and harsh environments, these strips are robust when zippered during unmating and feature an optional rugged metal latching system. Samtec’s full line of Edge Rate interfaces includes high-speed board level connectors, high-density arrays, edge card systems, cable assemblies, and panel and I/O systems.

For more information contact Samtec, +27 (0)11 452 8112, africa@samtec.com, www.samtec.com





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