Thermal interface material for IGBTs

28 October 2009 Manufacturing / Production Technology, Hardware & Services

Indium has developed its Heat-Spring metallic thermal interface material (TIM) specifically optimised for use with Infineon Technologies’ PrimePACK IGBT modules.

Many applications call for a TIM that can easily be placed against a backing plate and a cooling solution. Heat-Spring is a soft metal alloy (SMA) developed as a compressible metallic shim that can be used in IGBT mounting applications.

Heat-Spring has been tested for the latest PrimePACK configurations and has been optimised to reduce thermal resistance below that of other more traditional thermal interface materials.

Because of the increased number of fasteners used in the PrimePACK and its decreased width base plate, the Heat-Spring is ideally suited for this IGBT module. Heat-Springs are soft metal preforms that are compressible, allowing for adaptation to irregularities in the mounting surface. They do not contain silicone, do not out-gas, and do not exhibit pump-out which can occur with thermal greases and other viscous materials.

Heat-Springs are stable, easy to handle, and require no special mounting apparatus. They are highly conductive both thermally and electrically, are made of 100% recyclable and reclaimable metal and are considered a ‘green’ interface material.

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