Aries Electronics recently added new BGA Switch-A-Pitch adapters that adapt to pitch bottoms lower than previous models, expanding the product line that facilitates the use of smaller pitch devices with larger pitch boards. The new adapters have tops where the BGA landing pads are on a 0,50 mm pitch and the adapter bottoms are fitted with BGA balls on a 1,00 mm pitch.
Designed to adapt smaller pitch devices to larger footprints, the new adapters can reduce high density interconnect (HDI) construction. Switch-A-Pitch Adapters eliminate the need for laser-drilled microvias on motherboards, while enabling the use of standard line and trace spacing down to 0,75 mm.
The suggested PCB pad size is 0,50 mm for a 1,00 mm pitch. Adapters feature non-solder mask defined (NSMD) pads finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. Boards are 1,57 mm thick FR4 or Rogers 370 HR with 1/2 oz. copper traces on both sides. The adapter can operate up to 105°C for FR4 or up to 130°C for lead-free.
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