ON Semiconductor introduced an integrated bidirectional device, with positive and negative overvoltage protection (OVP) for portable electronics, and overcurrent protection (OCP) for accessories such as FM transceiver, loudspeakers and flash modules.
The NCP370 improves the front end protection of portable devices by providing positive protection up to +28 V and negative protection down to -28 V. Utilising an innovative architecture, this single device also provides OCP for the external accessories, which are connected on the bottom connector and supplied via a lithium-ion battery.
Integrated low on-resistance N-channel MOSFETs effectively support the direct high charge current up to 1,3 A requested by the portable electronics industry’s latest lithium battery charge levels. The NCP370 is available with several overvoltage thresholds to address the maximum rating of the downstream applications. Additionally, the device offers a second ‘reverse’ mode, enabling the regulation of the reverse current coming from a portable device’s battery to supply the external accessories such as an FM transceiver, audio functions or flash capabilities universally connected on the bottom connector of the portable devices.
The device is designed to internally limit current up to 1,6 A – a value that can be externally decreased by a pull-down resistor – thus eliminating the need for an external OCP device. The standby current of the device, which is lower than 1 μA, avoids any battery discharge when the wall adapter is unplugged or when the device is off, and so increases battery life and limits recharge iterations.
AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Java Card-based solution Future Electronics
Analogue, Mixed Signal, LSI
The SECORA ID Key S USB, from Infineon Technologies, is a Java Card-based solution with USB and NFC connectivity for secured authentication and digital signatures.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Cooling solutions for modern electronics Future Electronics
Passive Components
As electronic systems become more compact and powerful, effective thermal management has become a critical aspect of product design.
Read more...Same Sky expands rectangular connector portfolio Future Electronics
Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.
Read more...Advanced sensing powers modern drones Future Electronics
DSP, Micros & Memory
Allegro MicroSystems has a portfolio of sensors, motor drivers, and power management devices specifically designed to enhance drone efficiency, reliability, and control.
Read more...What happens when trust can no longer live only in software?
Computer/Embedded Technology Electronics Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions.
Read more...Rapid IoT prototyping simplified Future Electronics
Test & Measurement
The STEVAL-MKBOXPRO from STMicroelectronics is a compact, ready-to-use wireless development kit designed to accelerate the creation of intelligent IoT and wearable applications.
Read more...Cortex-M33 performance for cost-sensitive designs Future Electronics
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.
Read more...Next generation HMI processing platform Future Electronics
DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version