Bourns has developed a new power resistor specifically engineered to meet high-temperature soldering requirements to enable improved automated board assembly. The new PWR263S-20 features a D²PAK surface mount package, which provides a solution for space-constrained designs that have lead-free soldering temperature requirements. The new power resistor is designed to fit a broad range of applications that include industrial automation, telecommunication equipment, lighting controls, heating systems, battery chargers, inverter drives and general switch mode power supplies.
The 20 W power resistor features a low inductive resistive film which is well suited for high-frequency circuits and provides high surge capability suitable for applications requiring resistors to discharge capacitive energy. It also has a wide resistance range of 0,5 Ω 1% and 5% to 130 kΩ 1% and 5% for durability over a wide temperature range. The resistor features thermal resistance of 6,5°C and inductance of 0,1 μH.
Halo invests in high-speed data transformers 29 January 2020, ASIC Design Services
, Passive Components
Halo Electronics, a leading supplier of Ethernet transformers, has invested in UWB X Limited, a UK based technology company focused on creating a new high-speed transformer technology. As part of Halo’s ...
Read more...LAN transformers with automotive certification 29 January 2020
, Passive Components
Bourns’ signal magnetics product line has introduced three new LAN transformers: Model SM91071AL, SM91072AL and SM91073AL. These new products are single-port LAN 10/100 Base-T/isolation transformer modules ...
Read more...Selection software for capacitors 29 January 2020, RFiber Solutions
, Passive Components
Passive Plus Inc.’s (PPI) brand new Capacitor Application Program (CAP) helps engineers and designers select capacitors according to parameters such as capacitor value and frequency. CAP will provide ...
Read more...V2X: The future of vehicle communications 29 January 2020, Avnet South Africa
, Editor's Choice, Telecoms, Datacoms, Wireless, IoT
A recent report by Juniper Research forecasts that more than 62 million vehicles will be capable of vehicle-to-vehicle communication by 2023; up from just over 1,1 million in 2019.
Read more...STM32 system-on-chip for LoRa 29 January 2020, Avnet South Africa
, Telecoms, Datacoms, Wireless, IoT
Powering the search for sustainability through smart infrastructure and logistics, smart industry and smart living, STMicroelectronics has revealed the world’s first LoRa system-on-chip (SoC) for connecting ...
Read more...EERAM memory solutions retain data at power loss 29 January 2020, Avnet South Africa
, DSP, Micros & Memory
Microchip Technology announced a new family of Serial Peripheral Interface (SPI) EERAM memory products that offers system designers up to 25% cost savings over the current serial non-volatile ram (NVRAM) ...
Read more...28 GHz bandpass filter for mm-Wave 29 January 2020, RF Design
, Passive Components
The B274MB1S from Knowles is a bandpass filter with a passband from 26,5 to 29,5 GHz, ideally suited for 5G mm-Wave applications. It has an insertion loss of less than 3,5 dB and a rejection of 40 dB ...
Read more...High-voltage moulded power inductors 29 January 2020, RF Design
, Passive Components
Coilcraft has expanded its XEL family of high-performance, moulded power inductors to include three new higher-voltage series: the XEL401xV, XEL4020V and XEL4030V. All three offer operating voltage ratings ...
Read more...LAN interfaces transformers 29 January 2020, Würth Elektronik eiSos
, Passive Components
Würth Elektronik is expanding its extensive range of signal transformers. The new series of WE-STST (Super Tiny Signal Transformer) devices for LAN interfaces features a maximum component height of just ...
Read more...Non-inverting converters for buck or boost operation 29 January 2020, Avnet South Africa
, Power Electronics / Power Management
Texas Instruments introduced a family of four high-efficiency, low-quiescent-current (IQ) buck-boost converters that feature tiny packaging with minimal external components for a small solution size. ...
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