With the new ESD5V3U4U-HDMI TVS diode array, Infineon combines ESD protection with high-speed signal integrity and a straightforward PCB layout. The product targets digital televisions, DVD / Blu-ray players, recorders, game consoles, digital set-top boxes, LCD monitors and mobile communication equipment.
Applications include HDMI1.3, DisplayPort, USB 3.0, FireWire and MicroSD interface. The device is qualified to ensure ESD strikes of up to 20 kV (contact and air discharge), exceeding the standard IEC61000-4-2 level 4.
One of the most critical tests in the HDMI certification is the TDR (time domain reflectometry) characterisation of the HDMI sink eg, for an HD-TV. Even a small amount of added capacitance on an HDMI port precipitates a drop in the impedance of the differential pair, which can lead to heavily attenuated signals and consequently to certification compliance issues. For this reason, low-capacitance ESD protection devices like the ESD5V3U4U-HDMI – with a capacitance remaining at or below 0,4 pF (line to ground) over a frequency range from 1 MHz to beyond 3 GHz – are essential to keep signal integrity at an optimum without complex compensating PCB structures.
The array can save up to 50% board space in comparison with eg, ceramic protection devices in case size 0402, as one array device can protect four high-speed data lines at the same time. In applications like HDMI 1.3 or DisplayPort, the pin spacing of the connectors is 0,5 mm, identical to the pitch spacing of the ESD5V3U4UHDMI in the TSLP-9 package. This means that the device can be placed on top of two differential microstrip line pairs, avoiding multiple stubs and bends in the PCB traces that would cause reflections and signal attenuation.
First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Track with precision Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.
Read more...RGBIR sensor with I2C interface Electrocomp
Opto-Electronics
Available in a miniature opaque 2,67 x 2,45 mm package, Vishay’s VEML6046X00 includes high-sensitivity photodiodes, a low noise amplifier, and a 16-bit analogue to digital converter.
Read more...Thick film power resistors Electrocomp
Passive Components
Vishay has released a new product to the market, its thick film power resistor, which is offered in a clip-mount TO-247 package.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.