Interconnection


Fine-pitch bump adapters

20 January 2010 Interconnection

Aries Electronics has expanded its line of fine-pitch bump adapters to include versions that accommodate boards with pitches down to 0,40 mm. As part of the Correct-A-Chip series, the new adapters allow customers to use higher pitch devices on smaller pitch boards.

The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including thin-shrink small outline packages (TSSOP) and quad flat packages (QFP) with pitches down to 0,40 mm. In addition, the adapter bottom has raised connection pads up to 0,25 mm to enable easy mounting of the adapter to the target board. Due to the open space available on the top of the adapter board, manufacturers can easily add components to the design at minimal cost.

Fine-pitch bump adapter boards are 0,813 mm thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The parts can operate up to 105°C for FR4 and 130°C for lead-free processes. The new adapters are available in tape-and-reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0,076 mm can be used.



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