Easy-to-handle phase-change TIM

17 February 2010 Manufacturing / Production Technology, Hardware & Services

Bergquist has introduced the new Hi-Flow 330P phase-change thermal interface material (TIM) featuring one dry side and one naturally tacky side to accommodate efficient handling and dispensing. The new material delivers high thermal performance in addition to productivity benefits, achieving thermal impedance of only 0,17°C-in²/W at 50 psi.

The new material is electrically insulating, with its polyimide reinforcing film providing dielectric strength higher than 5 kV and high resistance to cut-through. The underside coating is a naturally tacky 52°C phase-softening compound suitable for automatic placement onto a heatsink. The topside 52°C phase-change compound is dry to the touch, allowing a power-dissipating component to be attached quickly and easily using a constant-force fastener such as a clip or spring.

Targeting applications such as high-performance computers, notebooks, discrete devices and power modules including motor drives and IGBT arrays, Hi-Flow 330P is delivered as sheets or bulk roll compatible with automated dispensing, containing die-cut squares or rectangles for standard component sizes. Its natural tack enables easy and predictable release from the carrier liner. Three reinforcement thicknesses are available – 0,114 mm, 0,127 mm and 0,140 mm – providing a choice of compromises between electrical insulation, resistance to cut-through and thermal impedance.

For more information visit www.bergquistcompany.eu

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