Thermal gap filler

17 February 2010 Manufacturing / Production Technology, Hardware & Services

MH&W has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3,0 W/mK of thermal conductivity between hot components and their heatsinks.

The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications.

Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material’s Shore 00 hardness is 55. TP-S3LS pads can be used in temperatures up to 200°C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0 and its dielectric breakdown voltage is more than 5,0 kV. The new material is available in 210 x 297 mm sheets or die-cut parts. Standard sheet thicknesses range from 0,5 to 5,0 mm. An optional fibreglass liner is available on 0,5 mm thick pads where added handling strength is needed.

For more information visit www.mhw-thermal.com

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