STMicroelectronics has introduced a single-chip audio subsystem IC that includes 3D sound enhancement for improved stereo effects in small devices offering high-quality sound.
The TS4982’s 3D sound-enhancement circuitry allows closely spaced speakers to deliver greater stereo spatial effects. This enables small devices to deliver a more satisfying, high-quality listening experience for users. The 3D effect is adjustable for low, medium or high volume levels, allowing equipment designers to optimise stereo enhancement according to the type and size of product. The level is set using two external pins on the device, and requires no additional circuitry.
The TS4982 includes a two x 2 W stereo speaker driver, a 125 mW stereo headphone driver, four-step digital volume control, pop-and-click reduction circuitry to attenuate unwanted system noises and PC-beep pass-through capability. Separate Enable signals for the headphone and speaker drivers allow low power consumption. The device also draws very low current of 10 nA in shutdown mode.
In addition to offering enhanced audio capabilities, the TS4982 also helps designers save PC board space through features such as ground-referenced circuitry for the headphone driver. This avoids the need to add DC-blocking capacitors; since DC-blocking capacitors also represent a source of noise, removing these contributes to higher audio quality. In addition, the device’s speaker driver has a bridge-tied load (BTL) output, which produces high audio power as well as high efficiency.
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