Themis Computer has announced availability of its innovative CoolShell server technology, which packages high-performance, multicore processor-based server motherboards with high-end graphics processing units (GPU) and enhanced network connectivity in a bladed server configuration. The new blades use CoolShell technology to achieve high server efficiency, while the use of commercial ‘server’ motherboards provides users a cost-effective, high compute density blade solution. CoolShell blade systems are targeted for applications that need a compact, lightweight solution that must operate in demanding environments.
CoolShell technology provides a thermal and kinetic management system that is stable and stiff, with a conduction cooled Processor Module ‘shell’, complete with external air flow paths, heat exchangers and impeller assembly – combined in a single, field replaceable unit (FRU). These servers combine advanced network connectivity with up to eight optical/copper ports and a simplified cabling system for easy installation and maintenance. They provide modular, front panel only access for all active components, and network and I/O security is assured through the use of independent controller channels, including both copper and fibre Gigabit Ethernet NICs.
The CoolShell CS-3U is a modularly maintainable, commercial blade server system that packs an extended complement of processing, memory and I/O, into a compact 3U, 17,75 inch deep rack-mountable CoolShell subrack which fits in a standard 19” rack. All cable connections are on the FRU front panels, so no rear access is required. The CS-3U includes five replaceable modules: a dual socket processor blade, an I/O module that accommodates up to three double high PCI-Express controller cards, media plus NIC module and two power supply modules.
The CS-3U processor blade is based on an industry standard, off-the-shelf motherboard. It includes two quad-core Intel Xeon processors with up to 64 GB of memory, two audio ports and an external PCI-Express expansion port, accessible from the front panel. The blade can be quickly updated to the latest processor technology since it is based on off-the-shelf components. New CS-3U processor blades can be available shortly after the latest technology commercial motherboards are brought to market and can easily be upgraded to the latest technology with plug and play FRU technology. Since all FRUs contain their own cooling path and impellers, higher power upgrades can be accommodated, without rebalancing chassis air flow.
For more information contact Rugged Interconnect Technologies, +27 (0)21 975 4524, www.ri-tech.co.za
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