Rugged blade servers

3 March 2010 Computer/Embedded Technology

Themis Computer has announced availability of its innovative CoolShell server technology, which packages high-performance, multicore processor-based server motherboards with high-end graphics processing units (GPU) and enhanced network connectivity in a bladed server configuration. The new blades use CoolShell technology to achieve high server efficiency, while the use of commercial ‘server’ motherboards provides users a cost-effective, high compute density blade solution. CoolShell blade systems are targeted for applications that need a compact, lightweight solution that must operate in demanding environments.

CoolShell technology provides a thermal and kinetic management system that is stable and stiff, with a conduction cooled Processor Module ‘shell’, complete with external air flow paths, heat exchangers and impeller assembly – combined in a single, field replaceable unit (FRU). These servers combine advanced network connectivity with up to eight optical/copper ports and a simplified cabling system for easy installation and maintenance. They provide modular, front panel only access for all active components, and network and I/O security is assured through the use of independent controller channels, including both copper and fibre Gigabit Ethernet NICs.

The CoolShell CS-3U is a modularly maintainable, commercial blade server system that packs an extended complement of processing, memory and I/O, into a compact 3U, 17,75 inch deep rack-mountable CoolShell subrack which fits in a standard 19” rack. All cable connections are on the FRU front panels, so no rear access is required. The CS-3U includes five replaceable modules: a dual socket processor blade, an I/O module that accommodates up to three double high PCI-Express controller cards, media plus NIC module and two power supply modules.

The CS-3U processor blade is based on an industry standard, off-the-shelf motherboard. It includes two quad-core Intel Xeon processors with up to 64 GB of memory, two audio ports and an external PCI-Express expansion port, accessible from the front panel. The blade can be quickly updated to the latest processor technology since it is based on off-the-shelf components. New CS-3U processor blades can be available shortly after the latest technology commercial motherboards are brought to market and can easily be upgraded to the latest technology with plug and play FRU technology. Since all FRUs contain their own cooling path and impellers, higher power upgrades can be accommodated, without rebalancing chassis air flow.

For more information contact Rugged Interconnect Technologies, +27 (0)21 975 4524, www.ri-tech.co.za

Further reading:

What happens when trust can no longer live only in software?
Computer/Embedded Technology Electronics Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions.

Read more...

---

Plug-in timing module
Comtest Computer/Embedded Technology
Microchip’s MD-990-0011-B timing module redefines the role of timing, making it possible for customers to seamlessly integrate advanced synchronisation at any stage of development.

Read more...

---

Advanced Layer 2 industrial switches
Vepac Electronics Computer/Embedded Technology
The Raptor EP4200 and EP5200 series switches provide advanced Layer 2 switching capabilities with high performance and availability tailored for demanding critical infrastructure and energy applications.

Read more...

---

Reliable isolation for modern networks
ASIC Design Services Computer/Embedded Technology
The Pro-Tek5 PTI Series delivers reinforced 5 kV Ethernet isolation for applications that demand robust protection, reliable signal integrity, and full IEEE802.3 performance.

Read more...

---

Next-gen modules for rugged edge AI systems
Altron Arrow Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.

Read more...

---

Fanless multimedia edge PC
Vepac Electronics Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.

Read more...

---

Advanced industrial connectivity at the edge
Future Electronics Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.

Read more...

---

A software-based controller for the industrial future
Phoenix Contact Computer/Embedded Technology
With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualised IT environments.

Read more...

---

5G mobile hotspot with integrated multimodal AI capabilities
CST Electronics Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.

Read more...

---

Panasonic TOUGHBOOK 33 2-in-1 detachable
Vepac Electronics Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.

Read more...

---