News


Kyzen to present paper at NEW SA

3 March 2010 News

Kyzen’s Fernando Rueda will present a paper entitled ‘The science of aqueous cleaning and matching the cleaning agent to the soil and equipment' at National Electronics Week South Africa, scheduled to take place 9–10 March 2010 at the Sandton Exhibition Centre.

Today’s challenge for printed circuit board manufacturers hinges on density and miniaturisation. High-performance electronic assembly designs drive multilayer and stacked package density, increasing number of I/Os, decreased area array pitches and tighter component standoff heights. Fernando Rueda, European sales manager at Kyzen, will present a paper highlighting the market pressures for higher functionality, cost reduction, cycle time reduction and improved quality driving electronic assembly innovations.

Continuing developments in the area of surface mount technology have also brought about additional cleaning needs. The uniqueness of aqueous cleaning fluids is the ability to engineer materials using a wide array of constituents properly designed to match up with soils, cleaning equipment, material compatibility constraints and process requirements. Kyzen’s presentation will discuss the science of aqueous-based electronic cleaning fluids, needed to meet today’s industry challenges.

Kyzen will be supporting MyKay Tronics in booth F11 and showcasing cleaning products from the Exaklean and Aquanox portfolios.

For more information visit www.kyzen.com





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved