Texas Instruments has introduced a family of standard-footprint power MOSFETs that dissipate heat through the top of the package for high-current DC-DC applications.
This new family of five DualCool NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. These MOSFETs can be used in a wide range of end applications including desktop personal computers, servers, telecommunications or networking equipment, base-stations, and high-current industrial systems.
The packages feature single phase 35 A synchronous buck converter MOSFETs, using single MOSFETs for both the high- and low-side switches. Enhanced packaging technology reduces thermal impedance to top of package to 1,2°C/W. The devices are housed in an SON package with a 5 x 6 mm.
Adaptive optics’ power solution Altron Arrow
Opto-Electronics
Vicor power-dense adaptive optical modules enable colossal telescopes to look into the past for deep space discoveries.
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Independent Power Producers (IPPs) and developers venturing into South Africa’s renewable energy sector face an onerous and challenging regulatory landscape characterised by uncertainty in securing grid connections and considerable development costs.
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The MAX77859 from Analog Devices is a high-efficiency, high-performance buck-boost converter targeted for systems requiring a wide input voltage range of between 2,5 and 22 V.
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This comprehensive solution is designed to help engineers evaluate the performance of TI’s SN6507 transformer driver for isolated power supplies.
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Telecoms, Datacoms, Wireless, IoT
Analog Devices’ ADPA1116 is a 0,3 to 6 GHz GaN-based power amplifier with a saturated output power (POUT) of 39,5 dBm.
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Telecoms, Datacoms, Wireless, IoT
STMicroelectronics recently introduced the Teseo VI family of global navigation satellite system receivers aimed at high-volume precise positioning use cases.
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